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Japan Intellectual Property Rights: CONDUCTOR WITH TERMINAL

Japan, Jan. 28 -- PROTERIAL LTD has got intellectual property rights for 'CONDUCTOR WITH TERMINAL.' Other related details are as follows: Application Number: JP,2022-053415 Category (FI): H01R4/18@A... Read More


Japan Intellectual Property Rights: ULTRA-FAST SETTING CEMENT MORTAR

Japan, Jan. 28 -- MITSUBISHI UBE CEMENT CORP has got intellectual property rights for 'ULTRA-FAST SETTING CEMENT MORTAR.' Other related details are as follows: Application Number: JP,2022-052397 Cat... Read More


Japan Intellectual Property Rights: SUPPORT PROGRAM

Japan, Jan. 28 -- BROTHER IND LTD has got intellectual property rights for 'SUPPORT PROGRAM.' Other related details are as follows: Application Number: JP,2022-052259 Category (FI): H04N1/00,127@B,B... Read More


Japan Intellectual Property Rights: INFORMATION PROCESSING DEVICE AND IMAGE PROCESSING PROGRAM

Japan, Jan. 28 -- FUJIFILM BUSINESS INNOVATION CORP has got intellectual property rights for 'INFORMATION PROCESSING DEVICE AND IMAGE PROCESSING PROGRAM.' Other related details are as follows: Applic... Read More


Japan Intellectual Property Rights: THERMOELECTRIC CONVERSION MODULE

Japan, Jan. 28 -- NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY has got intellectual property rights for 'THERMOELECTRIC CONVERSION MODULE.' Other related details are as follows: A... Read More


Japan Intellectual Property Rights: DRIVING DEVICE AND OPTICAL DEVICE

Japan, Jan. 28 -- FUJIFILM CORP has got intellectual property rights for 'DRIVING DEVICE AND OPTICAL DEVICE.' Other related details are as follows: Application Number: JP,2022-051666 Category (FI): ... Read More


Japan Intellectual Property Rights: POWER SEMICONDUCTOR MODULE AND ELECTRIC POWER CONVERSION DEVICE USING THE SAME

Japan, Jan. 28 -- HITACHI POWER SEMICONDUCTOR DEVICE LTD has got intellectual property rights for 'POWER SEMICONDUCTOR MODULE AND ELECTRIC POWER CONVERSION DEVICE USING THE SAME.' Other related detail... Read More


Japan Intellectual Property Rights: GRINDING METHOD OF WAFER

Japan, Jan. 28 -- DISCO ABRASIVE SYST LTD has got intellectual property rights for 'GRINDING METHOD OF WAFER.' Other related details are as follows: Application Number: JP,2022-051346 Category (FI):... Read More


Japan Intellectual Property Rights: LAMINATED MOLDED OBJECT PRODUCTION METHOD

Japan, Jan. 28 -- TOYOTA MOTOR CORP,EXONE CO LTD has got intellectual property rights for 'LAMINATED MOLDED OBJECT PRODUCTION METHOD.' Other related details are as follows: Application Number: JP,202... Read More


Japan Intellectual Property Rights: SUPPORT PROGRAM AND PRINTING SYSTEM

Japan, Jan. 28 -- BROTHER IND LTD has got intellectual property rights for 'SUPPORT PROGRAM AND PRINTING SYSTEM.' Other related details are as follows: Application Number: JP,2022-050422 Category (F... Read More